AI & Tech Confirmed First seen 2026-10-12 15:00 UTC

NVIDIA and Cisco announce USFP pluggable optics form factor

NVIDIA and Cisco announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), described as a new high-density 400Gb/s-per-lane optical module. The companies say it is designed to equip the hardware ecosystem for the next generation of AI factories using pluggable transceivers.

Why “Confirmed”

Published by a primary source: NVIDIA Newsroom

1 independent source group across 1 post · evidence score 90/100. How labels work

What the sources claim

NVIDIA and Cisco announced plans for a new high-density 400Gb/s-per-lane optical module called Ultra-Dense Small Form Factor Pluggable (USFP).

“NVIDIA and Cisco today announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a new high-density 400Gb/s-per-lane optical module”
NVIDIA Newsroom
The USFP module is designed to equip the hardware ecosystem for the next generation of AI factories using pluggable transceivers.

“designed to equip the hardware ecosystem for the next generation of AI factories using pluggable transceivers”
NVIDIA Newsroom

Sources

NVIDIA Newsroom primary 2026-10-12 15:00 UTC
NVIDIA and Cisco Introduce New Pluggable Optics Form Factor to Scale AI Factories

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Summary and claims extracted by AI with prompt analyze-story@5 on 2026-10-12 15:10 UTC. Labels are computed from the sources, not by the model.